Posts Tagged ‘Memory’

Flexible transparent PC memory achieved in chemistry lab

April 3rd, 2012

Researchers at Rice University in Houston, Texas have recently made a breakthrough in the development of transparent, flexible computer memory using silicon oxide as the active component. According to university chemist James Tour, the breakthrough could soon allow for flexible, bendable touchscreens, transparent integrated circuits and flexible batteries, among other mobile hardware components.

“Generally, you can’t see a bit of memory, because it’s too small,” said Tour, Rice’s T.T. and W.F. Chao Chair in Chemistry. “But silicon itself is not transparent. If the density of the circuits is high enough, you’re going to see it.”

The transparent memory breakthrough is based upon a 2010 chemistry discovery that pushing a strong charge through standard silicon oxide, an insulator widely used in electronics, forms channels of pure silicon crystals less than 5 nanometers wide. The initial voltage appears to strip oxygen atoms from the silicon oxide; lesser charges then repeatedly break and reconnect the circuit and turn it into nonvolatile memory. Nevertheless, a smaller signal can be used to poll the memory state without altering it.

Just as with Intel’s 3D-stacked transistor approach in Ivy Bridge processors and beyond, researchers at Rice hope to develop a transparent memory device that can be stacked in a three-dimensional configuration and attached to a flexible substrate.

Source:http://www.fudzilla.com/home/item/26608-flexible-transparent-pc-memory-achieved-in-chemistry-lab

PNY Announces Addition of 2133MHz and 1866MHz PC Memory to XLR8(TM) Line-Up

March 29th, 2012

PNY Technologies®, Inc. (“PNY”) today announced the expansion of their XLR8™ (ac–cel–er–ate) PC Memory to include 2133MHz and 1866MHz in 16GB and 8GB kits.

The 2133MHz DDR3 CAS 10 desktop memory kit is available in 8GB (2 x 4GB) dual channel and 16GB (4 x 4GB) quad channel versions with 9-12-11-27 timings. PNY’s fastest memory kits to date meld together the perfect combination of high-speed, low-latency, and racy aesthetics. They feature custom red aluminum heat spreaders designed with fins for more efficient heat dissipation and optimum thermal management. Hardware enthusiasts and gamers will appreciate the new performance, as well as look and feel of PNY’s latest memory modules, and feel secure with the PNY Lifetime Warranty.

This high-end XLR8 Enthusiast Edition memory upgrade is available in 16GB and 8GB densities. Hard core gamers and performance enthusiasts can appreciate this great addition to PNY’s PC Memory line-up.

PNY has also launched 8GB (2 x 4GB) and 16GB (4 x 4GB) DDR3 CAS 9 desktop memory kits in 1866MHz with 9-12-9-27 timings. These XLR8 Performance Edition memory kits feature sleek, black aluminum heat spreaders and were designed especially for gamers and enthusiasts. Additionally, PNY has also launched a 16GB (4 x 4GB) DDR3 CAS 9 desktop memory kits in 1600MHz with 9-9-9-24 timings. Also part of the XLR8 Performance Edition, this dual channel memory kit features sleek, black aluminum heat spreaders.

“Operating speeds of 1600MHz and greater have become the sought after memory for gamer consumers and we’re broadening our range of high-performance XLR8 memory to hit gamers at every level,” said Nicholas Mauro, senior marketing manager, PC components for PNY. “The 16GB DDR3 2133MHz kit is now the highest capacity and fastest memory in our line-up, offering the extreme performance that the games of today demand. In addition, all of our new memory kits are great compliments to PNY’s line of XLR8 Gaming graphics cards.”

16GB (4 x 4GB) DDR3

2133MHz — $179.99
1866MHz — $124.99
1600MHz — $89.99

8GB (2 x 4GB) DDR3

2133MHz — $89.99
1866MHz — $59.99

PNY offers a Lifetime Warranty and free 24-hour technical support for the entire line of memory upgrade modules. All new PNY XLR8 PC memory kits are now available for purchase at select e-tailers, retailers, and PNY.com.

For more information on the complete line of products that PNY has to offer, visit www.PNY.com. For the gaming enthusiast, visit PNY’s on-line gaming portal at www.XLR8gaming.net to participate in forums, special offers, contests and tournaments taking place now! Gamers can also check out compLexity Gaming — one of the world’s most prolific gaming organizations. PNY holds the distinct honor of being the “Official Video Card and PC Memory Sponsor” of compLexity Gaming.

Source:http://www.sys-con.com/node/2224427

ADATA Launches New Line of DDR3L ECC Memory for Micro Servers

March 26th, 2012

With an eye towards micro server applications and enterprise cloud computing solutions, ADATA rolled out a brand new line of DDR3L ECC SO-DIMM memory modules featuring low voltage, large densities, and rapid processing capabilities.. There are 1333MHz and 1600MHz kits available in 4GB and 8GB capacities, each of which requires 1.35V, according to ADATA’s spec sheet.

“ADATA DDR3L ECC SO-DIMM fully meets the requirements of most high density and energy efficiency micro-servers. They are also the first memory module running at 1.35V that can fully support low voltage CPUs and make the most of processing efficiency and computing density,” Jacky Yang, product manager at ADATA, said in a statement. “The entrance of these new Server DIMM modules are evidence of ADATA’s commitment to reduced costs and sustainable operating models for large data centers worldwide.”

ADATA points to the growing prominence of micro servers, which have become increasingly popular solutions for large data centers and information service suppliers in the last two and a half years, as the being the motivation behind these kits.. With the combination of low power processors, ADATA believes its new RAM is ideally suited for these applications.

Source:http://hothardware.com/News/ADATA-Launches-New-Line-of-DDR3L-ECC-Memory-for-Micro-Servers/

Samsung And Microsoft Collaborate On Green Memory / Cloud Servers

March 5th, 2012

Microsoft and Samsung may be rivals in a lot of ways, but in the tech universe, even competitors can put their differences aside and come together at times. These two have recently announced their intentions to cooperate of more efficient cloud implementations, testing our servers that utilize the world’s first 20nm class Green Memory in Munich. A system based on Samsung’s 20nm-class DDR3 memory and solid state drives (SSDs) together with Microsoft Windows Server 2008 R2 and Hyper-V proved to be twice as fast as current memory configurations for servers setting up virtual machine instances and recovering data in private cloud environments. These advanced configurations also consumed as much as 50 percent less power per server.

“In an increasingly complex IT world, Microsoft Technology Centers (MTC) are set to provide complete solutions to customers, and we achieve this goal through strong collaboration with our partners. With Samsung’s Green DRAM and SSDs, we have just such a partner on board at the MTC in Munich to educate and to provide highly advanced solutions to our customers,” said Chris Bayer, Director, MTC Munich.

“By utilizing the green server solution which combines the two companies’ leading-edge developments including green 20nm-class DRAM and SSD, our customers can enjoy achieving a high level of performance and efficiency in their server systems and also highly effective IT investment without having to increase the total cost of ownership,” said Wanhoon Hong, executive vice president of memory sales & marketing, Device Solutions, Samsung Electronics.

Samsung’s 20nm-class Green was tested in 8GB DDR3 registered dual inline memory modules and in the SATA 6Gb/s 256GB SSD PM830 series, installed on server systems running virtualized environments with the Windows Server 2008 R2 Enterprise operating system and Hyper-V. They delivered power conservation and time savings of 50 percent compared to systems using 40nm-class* DDR3 and enterprise grade HDD.

Samsung enabled the Green memory solution that combines 20nm-class DDR3 modules and SATA 6Gbps SSDs for advanced server systems only five months after collaborating with MTC Munich for development of an optimized server solution that utilizes 30nm-class* green DDR3 memory modules. Samsung and Microsoft are planning to extend their collaboration to the other 27 MTCs worldwide in 2012. Test platforms equipped with Samsung Green SSDs are now available at MTC Munich and 20nm-class DDR3 server modules will be available at MTC Munich in the second quarter of this year. Will it all bleed over to the consumer universe? Perhaps — this is definitely a good start either way, though.

Source:http://hothardware.com/News/Samsung-And-Microsoft-Collaborate-On-Green-Memory–Cloud-Servers/

Designer of Microprocessor-Memory Chip Aims to Topple Memory and Power Walls

January 18th, 2012

Whether you’re talking about high performance computers, enterprise servers, or mobile devices, the two biggest impediments to application performance in computing today are the memory wall and the power wall. Venray Technologies is aiming to knock down those walls with a unique approach that puts CPU cores and DRAM on the same die. The company has been in semi-stealth mode since it inception four years ago, but is now trying to get the word out about its technology as it searches for a commercial buyer.

Dallas-based Venray is the brainchild of Russell Fish, who made himself the CTO (there is no CEO listed on the website) and the principal architect. Fish is co-designer of the Sh-Boom Processor, and holder of multiple microprocessor patents. These patents turned out to be fundamental to the operation of modern microprocessors and have been licensed by practically every computer and semiconductor manufacturer on the planet. The proceeds from those patents are being used to fund Venray.

Since 2007, Fish and company have been engaged in the design and marketing of a novel CPU-DRAM technology, known as TOMI, which stands for Thread Optimized Multiprocessor. With TOMI, the company aims to do what no other chip maker has done before, namely embed a general-purpose processor in vanilla DRAM. The idea is to use the physical proximity of the CPU and memory, as well as extra-wide busses (4,096 bits, in the case of the first TOMI designs), to flatten the memory wall.

The memory wall is huge problem in high performance computing and big data applications today and will soon limit computing across all segments. The problem was brought home by a 2008 study of multicore performance at Sandia National Labs, in which researchers demonstrated that for certain classes of data-intensive applications, the use of extra cores to increase performance is counter-productive.

For these application profiles, performance basically flattened between four and eight cores, and actually declined beyond that. The problem was that as more cores were added, they were starved for the limited amount of memory bandwidth available, and after a certain point, the overhead of memory contention actually decreased performance. Prospective solutions, such as memory chip stacking (for example, Micron’s Hybrid Memory Cube) are unproven and have yet to find their way into the commercial market.

Some microprocessor-memory integration has been attempted with embedded DRAM (eDRAM), a technology that promises a lot more capacity than can be delivered by on-chip cache memory. It has been used as a foundation for some integrated SoC devices including IBM’s Power7 CPU and Blue Gene ASIC, as well as for many of the processors that power game console devices, such as the Sony PlayStation. Embedded DRAM was also the memory technology of choice for the 2000-era IRAM research effort, which aimed to integrate a 256-bit vector microprocessor with 16MB of memory.

But even though eDRAM is much denser than cache memory, it can’t provide the storage capacity of conventional DRAM. It is also hundreds of times as expensive as regular memory. “The people that have tried to combine CPUs and memory before have usually erred on the side of having the CPUs too big and the memory too small,” says Fish. “They did not understand the difference between embedding DRAM in CPUs and making CPUs in DRAMs.”

The challenge of melding CPUs with DRAM is that microprocessors are much more complex beasts than memories, and as a result, are manufactured with entirely different semiconductor processes. Typically semiconductor logic require ten or more layers of material to be laid down on the die, compared to just three for DRAM. However, if a microprocessor can be designed much more simply, reducing the number and complexity of logic gate connections, it is possible to more or less flatten the layout and use just three layers.

That is the fundamental magic used by TOMI. Its second-generation design, named Borealis, consists of an 8-core RISC CPU built using the three-layer DRAM process. The CPU itself is made up of just 22 thousand transistors (not including cache and the memory controller), embedded in a 1 Gbit DRAM chip. On the 42nm process node, the CPU takes up just 14 percent of the die.

It is possible to use the TOMI technology to implement legacy microprocessor architectures, but big CPUs, in particular, would not be able to squeeze onto their DRAM process technology — at least not at current CMOS geometries. In any case, Fish seem to think the optimal mix of memory to logic is around 5 to 1.

To get to that level, Fish and company pared down its CPU to just the basics: 32-bit integer hardware, and a small set of instructions (forgoing less useful instructions like auto-index and auto-decrement). The lack of floating point hardware, which tend to suck up a lot of silicon real estate, doesn’t rule out for support for those operations; they are just emulated via software libraries.

A very useful side effect of using the simpler DRAM processes is that it’s much cheaper to produce a CPU this way. The cost of manufacturing a billion DRAM transistors is less than a dollar versus more than $300 for a microprocessor. But another big savings is in power draw. The Borealis CPU at 2.1 GHz draws a measly 98 mW. Compare that to the 100-plus watts for an x86 CPU sporting a billion transistors.

Of course, the Borealis CPU is much less performant compute-wise. It’s specifically built to maximize the throughput of analytics applications chewing on large datasets, aka big data. “We’ve probably built the most efficient big data processor in existence,” claims Fish.

To prove their point, Venray benchmarked their hardware with Sandia Labs’ MapReduce-MPI software and an unstructured data application running on their hardware — a circuit board with 16 Borealis chips (128 cores, 16GB of DRAM). According to the company, the TOMI system was able to achieve nearly 12 times the performance and use less than 1/10 the power compared to the same code running on an Intel Xeon-based cluster. Venray says the hardware would cost about $35 thousand versus $1.65 million for the equivalent x86 system.

Beyond benchmarks, TOMI is built for all sorts of data mining, high-end analytics, and pattern recognition software. To Fish, these are the killer applications that will drive the industry in the future. And since the architecture is naturally energy efficient, TOMI would be equally at home in mobile devices and in cloud servers.

The downside, of course, is that unlike x86 and ARM, the architecture has no vast ecosystem behind it. But according to Fish, by providing a C/C++ compiler via gcc, the whole Linux toolchain can be leveraged. For legacy applications, the bigger problem is the recoding that would have to be done. Most applications assume powerful single-threaded CPUs and small memory footprints, rather than the inverse. None of this deters Fish, who sees the legacy CPU architectures as a dead end, especially for big data applications that is poised to drive a lot of growth in the IT sector.

At this point, Fish and his cohorts are actively in search of a single buyer for TOMI, most likely a computer manufacturer of some sort. According to him, the advantage of the technology is wrapped up in its exclusivity, so licensing the IP would dilute the value to prospective customers. To date, they have received the most attention from buyers outside the US. One overseas group was ready to write “a large check,” but Fish declined, wanting to give US-based companies a shot. According to him, in the past five or six months, prospective buyers in the US have shown increased interest. “Lots of people want to be our friends right now,” he says.

Source:http://www.hpcwire.com/hpcwire/2012-01-17/designer_of_microprocessor-memory_chip_aims_to_topple_memory_and_power_walls.html

Corsair Introduces Vengeance High-Performance Memory For Laptops

December 2nd, 2011

Corsair announced a line of high-performance memory upgrade kits for laptops that use the 2nd generation Intel Core processor family. The new 4GB and 8GB Vengeance SODIMM kits operate at speeds of 1600MHz and 1866MHz. Corsair has designed the Vengeance laptop memory to be plug-and-play so you won’t have to make any BIOS adjustments. The new kits are designed to work with any PC or notebook which accepts standard DDR3 SODIMMs.

A worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced a line of high-performance memory upgrade kits for power laptop users.

Operating at speeds of 1600MHz and 1866MHz, the new Vengeance laptop memory upgrade kits are an ideal solution for notebooks equipped with a 2nd Generation Intel Core i5 or Core i7 processor. Vengeance laptop memory is designed to be plug-and-play, with no BIOS adjustments needed to instantly take advantage of the faster memory speed.

The new Vengeance high-performance memory upgrade kits for laptops are designed to work with any PC or notebook which accepts standard DDR3 SODIMMs, and are backward compatible with notebooks and laptops which use first-generation Intel Core i5 and Core i7 processors. Even on older notebooks, customers can still take advantage of the ability to upgrade to 8GB of memory using only two memory slots, and enjoy the confidence of Corsair’s renowned service and support.

“As more complex applications and games are available in the market, many laptop users are looking for an easy way to improve their system performance in order to have the best experience.” said Thi La, Vice President of Memory Products at Corsair. “Our new Vengeance high-performance laptop memory kits allow performance-minded customers to boost their memory performance and capacity in an instant.”

The new Corsair Vengeance high-performance notebook memory upgrade kits are available immediately from Corsair’s worldwide network of resellers and distributors.

Source:http://hothardware.com/News/Corsair-Introduces-Vengeance-HighPerformance-Memory-For-Laptops/

The Social Engineer’s Guide to Buying an Expensive Laptop

November 28th, 2011

Laptops are almost a necessity in today’s society. It doesn’t help that a laptop that can actually increase your work productivity will put at least a $1,500 dent in your wallet. I’m sure you have searched around to try to find factory direct deals, or (shiver) even looked at used laptops, but that isn’t the way to go. You need something that actually has a warranty, and good performance, but at the same time, doesn’t require you to sell a kidney. This can cause quite a dilemma, as it can take some people months or years to save up for even the worst computer.

Well, if you are a computer gamer, or just an enthusiast, you have probably heard of Alienware. They are most expensive, the most gorgeous, and above all else, the most powerful gaming laptops in the universe (no, people… having 3 hard drives doesn’t make Sager better). The drawback of these beasts are the steep prices. To get the specifications maxed out Alienware, it will run you back 5 to 6 grand. This is the power that you get to play with:

* Screen: 18.4″ 1080p WLED
* Processor: Intel Core i7 2960XM 2.7GHz (3.7GHz with Turbo Boost, 8MB Cache)
* Memory: 32GB Dual Channel DDR3 at 1333MHz (4DIMMS)
* GPU: Dual 2GB GDDR5 AMD Radeon 6990m (4GB)
* Storage: Up to 512GB Solid State Drive SATA hard drive
* Misc: SATA3, USB 3.0, HDMI input, 4 year warranty and more
* Total: $6,949.00

This is a force to be reckoned with. However, the toll for this gorgeous piece of hardware will do some damage to your wallet. What if it doesn’t have to, though? What if I told you, that with some clever shopping, and some hardcore social engineering, I got this laptop down to $2,000? No joke. In today’s Null Byte, I am going to show you exactly what it takes to get the most out of your money from Alienware. I’m going to sleuth around and get the best price on parts and then finish off with some social engineering to lower my price even more. This isn’t just for Alienware, though. These methods are applicable to all things expensive. Pay close attention, this could save you enough money to buy a car.

Social engineering is a natural-born talent for some people. Convincing someone to trust you, and playing on human emotion can really save your skin when it comes to big spending. I’ve used it to my advantage more than I can remember when it comes to purchasing things.
Step 1 Prepare for Battle

Before we begin, we should shop around for upgraded parts and see if we can get them cheaper elsewhere. This will put a good dent in the preliminary price on our order, making minimal to no sacrifice in regards to performance. Upon looking around, here is the modified list that we can come up with:

* Screen: 18.4″ 1080p WLED
* Processor: Intel Core i7 2860QM 2.5GHz (3.6GHz with Turbo Boost, 8MB Cache). I swapped this out to the 2860QM because it costs half as much and can be easily overclocked to be faster than the 2960XM, while maintaining a 8MB cache size. Clearly a better option.
* Memory: 16GB Kingston HyperX PnP Triple Channel DDR3 at 1866MHz (4DIMMS). I chose to order RAM from someone other than Alienware and “downgraded” from 32GB of 1333MHz to 16GB of Triple channel memory clocked at 1866MHz. This upgrade is much faster, and can be overclocked to 2000MHz, easily. Almost a 100% speed increase is achieved while we also save $1,780.00. This means that we also get 4GB of RAM for free with the laptop because it comes with it, stock. Sell it.
* GPU: Dual 2GB GDDR5 AMD Radeon 6990m (4GB). Stick with the dual AMDs—they are faster than the nVidia 580m cards and are a lot cheaper. Option seems pretty clear to me.
* Storage: 256GB OCZ SATAIII SSD R/W 500/MBs. This drive is faster than any of the drives offered through Alienware. I chose only one because an SSD larger than this, for now, is pretty ridiculous. The Alienware will still come with a 500GB HDD, which can be used for storage, so you can keep the OS and your games on the SSD to increase performance greatly.
* Warranty: 1 year advanced warranty. I upgraded to the 1 year advanced plan to cover accidental damages. A lot of people do not know this, but a few months before your warranty runs out, you can call the factory and pay to have the warranty extended. Why pay for it now if we don’t have to?
* New Preliminary Total: $2,860 on the Alienware. $3,380 is our new grand total, with extra parts included. We have already saved more than 50% for a rig that outperforms what we would have had.

Source:http://www.businessinsider.com/the-social-engineers-guide-to-buying-an-expensive-laptop-2011-11

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